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Jedec/Waffle Trays

Antistat ensure all our waffle / IC trays are antistatic and are available for use as either IC shipping and/or IC baking trays. Heat resistance requirements should be specified at the point of order.

All our shipping trays are built in compliance with JEDEC thick and thin standard dimensions. Mid temperature trays can be baked to 140°C while low temperature trays can withstand a maximum sustained temperature of 65°C. Trays are constructed in modified polysulfone (PS) or equivalent for mid-temperature applications and polycarbonate (PC) for low temperature applications because of their high deflection temperature, superior strength, and dimensional stability. All JEDEC trays have the same "X" and "Y" dimensions and are easily stacked for storage and manufacturing.

Antistat are able to provide certain waffle trays from stock, however if you require trays for packaging more complex semiconductor devices then please contact us as we may be able to offer an alternative solution.



Antistat offers trays for the following package types:

BGA
CABGA
CBGA
CFP
CQFP
CSP
DSBGA
EPBGA
FBGA
FCBGA
FQFP
LCC
LFBGA
LFP
LQFP
MLF
MQFP
PBGA
QFN
PGA
PLCC
PQFP
QFP
SOIC
SSOP
SVFP
TBGA
TQFP
TSOP
TSOPII
VFBGA


For further information, please contact one of our sales team on +44 (0) 1473 836 200.

View JEDEC Tray Dimensions here: Link

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Ant Group comprises of Antistat, Acupaq, Cygna, Cyberpac and Integrity, all of which are trading divisions of ESD Control Centre Ltd. Registered No. 2526954. Registered Address: Integrity House, Easlea Road, Bury St Edmunds, Suffolk, IP32 7BY, UK. This site and all contents are © 2017 Antistat