JEDEC TRAYS
Antistat JEDEC Trays; ESD-Safe Solutions for IC Transport and Baking.
All our shipping trays are built in compliance with JEDEC thick and thin standard dimensions. Mid temperature trays can be baked to 140°C while low temperature trays can withstand a maximum sustained temperature of 65°C. Trays are constructed in modified polysulfone (PS) or equivalent for mid-temperature applications and polycarbonate (PC) for low temperature applications because of their high deflection temperature, superior strength, and dimensional stability.
All JEDEC trays have the same “X” and “Y” dimensions (320mm x 135mm) and are easily stacked for storage and manufacturing.
We offer a range of JEDEC trays from stock, however due to the complexity and number of variations available we only feature our most popular variations online.
View our online range of JEDEC trays available to buy now.
If you require trays for packaging more complex semiconductor devices, please contact us to request a quote for your specific requirements.
Images show a TQFP type JEDEC tray
Antistat offers trays for the following package types:
| BGA | CABGA | CBGA | CFP |
| CQFP | CSP | DSBGA | EPBGA |
| FBGA | FCBGA | FQFP | LCC |
| LFBGA | LFP | LQFP | MLF |
| PBGA | PGA | PLCC | PQFB |
| QFN | QFP | SOIC | SSOP |
| SVFP | TBGA | THIN TBGA | TQFP |
| TSOP | TSOP I | TSOP II | VFBGA |
To complete your packaging, Antistat also provide a JEDEC tray cover with black dissipative low density polyethylene foam. The static dissipative tray lid is designed for safe handling and transport of products. This product has maximum product protection and is exceptionally easy to use. Our Conductive PCB Hook and Loop Strap is ideal for binding individual packages together safely and securely.
Enquire now to find out more about our range of Jedec Trays
Antistat specialises in component and transportation packaging. Fill out the form below, and a member of our sales team will contact you shortly.
