HIGH TEMPERATURE MASKING TAPE
This high temperature masking tape is a polyimide, pressure-sensitive, adhesive tape with silicon resin which shows excellent dielectric insulation properties, high heat resistance and excellent solvent resistance. Offers dimensional stability and excellent electrical and physical properties over a wide range of temperatures.Ideal for masking printed circuit boards during wave solder or solder dip processes, as well as for solder wave masking and electrical insulation. Neither corrosive nor ozone-depleting and is both flame and chemical resistant.
A total thickness of 0.070mm and can withstand heat up to 230°C. Uses a silicon resin adhesive that provides excellent solvent resistance, making it suitable for high-temperature applications. Ideal for demanding environments requiring heat and chemical resilience.
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